Capability
Tin Plating
Tin is a white, non-toxic, conductive, solderable deposit valued for its corrosion resistance, its electrical performance, and its ability to be soldered cleanly even after long shelf life. It forms a thin protective oxide layer that shields the substrate from corrosion without compromising conductivity or solder behavior.
Those properties make tin a dominant finish in the electronics, electrical assembly, food processing, and shipping industries, where contact resistance, solderability, food safety, and freedom from toxic chemistries are non-negotiable. The deposit is also soft and malleable enough to form, bend, or deform without cracking the plating.
Solderability
Excellent
Contact Resistance
Low & Stable
Typical Thickness
2–25 µm
Processing
Rack & Barrel
Where Tin Plating Fits
Common Applications
Tin's combination of solderability, low contact resistance, food safety, and corrosion resistance makes it the standard finish across a wide range of industries.
- Electrical connectors and contacts — terminals, lugs, pins, sockets, and the connector hardware that needs stable contact resistance over service life
- Bus bars and power distribution hardware — high-current copper bus bars where tin maintains low joint resistance and supports clean soldered connections
- Battery interconnects — bus bars and tabs in hybrid, EV, and energy storage assemblies that move significant current cycle after cycle
- Semi-conductor and component leads — solderable preserve coating for electronic component assembly
- Food processing and shipping — non-toxic, FDA-compatible finish for food-contact hardware, cans, and processing equipment
- Stampings, screw machine parts, and tubular components — high-volume general industrial hardware where solderability or corrosion resistance is needed
- Fasteners and fittings — electronics-grade and electrical-assembly fasteners
Finish Options
Matte Tin, Bright Tin, and Whisker Mitigation
Tin is deposited in two common visual finishes. Matte tin is essentially pure tin with no brighteners — softer, more ductile, easier to solder over time, and the modern preference for most electronics applications because of its lower tendency to form tin whiskers. Bright tin uses brightening additives in the bath to produce a shinier deposit, often specified for cosmetic visibility or where mating-surface appearance matters.
Tin whiskers — thin filamentary tin growths that can form spontaneously on plated surfaces over time — are a known concern in electronics, particularly since the industry moved away from tin-lead toward pure tin under RoHS and lead-free directives. Modern process control, sufficient deposit thickness (typically 10 µm or more for high-reliability applications), and where required, post-plating thermal treatments significantly reduce whisker formation. We work with customers' specifications and end-application requirements to recommend the right tin process for whisker-sensitive programs.
Specifications & Standards
Standards We Can Meet
ASTM B545
Standard specification for electrodeposited tin coatings
MIL-T-10727
Military specification for tin plating, electrodeposited or hot-dipped
SAE-AMS-2408
Aerospace material specification for tin plating
ANSI/J-STD-002
Component solderability testing reference
IATF 16949
Automotive quality management process control across all facilities
RoHS, REACH
Lead-free, fully compliant with global electronics and ELV directives
Specifying tin for a part?
Send us a drawing, an electrical or solder ability specification, or a part description. We’ll recommend the right tin chemistry (acid or alkaline), the right finish (matte or bright), and the right processing method for your geometry, your substrate, and the standard your program runs to.